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Protochips
Dimple Grinder II
Model 657
Fast and reliable mechanical method of pre-thinning to near electron transparency to greatly reduce your ion milling times and uneven thinning.
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견적 및 서비스 요청
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ADVANTAGES
Large transparent areas:
Utilizes both the large wheel and flat wheel to preserve a large transparent area after processing
Stronger specimens:
Leaves a thick supporting rim to protect and strengthen the specimen after dimpling
Direct preparation of TEM specimens:
Produces a final thickness of <3 μm in dimpled specimens
Accurate depth and thickness control:
User-defined stop point and real-time display ensure you can produce the appropriate dimple depth and thickness
Micro-positioning:
Provides both orthogonal and intersect axes for more accurate positioning
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